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Title:
THERMAL TREATMENT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/181463
Kind Code:
A1
Abstract:
This thermal treatment apparatus includes: a chamber that houses a semiconductor wafer W; a halogen heating unit and a flash heating unit that heat the semiconductor wafer; a plurality of sensors that measures parameters related to heating of the semiconductor wafer; a storage unit that stores data measured by the plurality of sensors; and an operation unit that predicts an output value from a first sensor among the plurality of sensors. The output value from the first sensor is predicted on the basis of data measured by the first sensor among the plurality of sensors and data measured by a second sensor having correlation with the first sensor.

Inventors:
UENO TOMOHIRO (JP)
KITAZAWA TAKAHIRO (JP)
Application Number:
PCT/JP2022/037045
Publication Date:
September 28, 2023
Filing Date:
October 04, 2022
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/26
Domestic Patent References:
WO2021131276A12021-07-01
Foreign References:
JP2019087632A2019-06-06
JPH10270454A1998-10-09
JP2019169500A2019-10-03
JP2009117798A2009-05-28
JP2014042042A2014-03-06
JP2014534641A2014-12-18
JP2000509171A2000-07-18
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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