Title:
THERMAL- AND UV-CURING ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/095882
Kind Code:
A1
Abstract:
Provided is an adhesive that is resistant to peeling off during heat-curing when a lens holder is adhered to a substrate having an image sensor fixed thereon in assembling a camera module, and that has excellent thermal durability after being cured. A thermal- and UV-curing adhesive composition contains (a) at least one urethane acrylate oligomer containing at least one polycarbonate-based urethane acrylate oligomer, (b) at least one acrylate monomer, (c) at least one particulate rubber, (d) at least one polyamine curing agent having a primary amine and/or a secondary amine, and (e) at least one photopolymerization initiator, wherein the at least one urethane acrylate oligomer (a) has a weight average molecular weight of 4,000 or more, and the at least one particulate rubber (c) is present in an amount of 5% by weight or more in the entire composition.
Inventors:
NATORI TOSHIKI (JP)
Application Number:
PCT/JP2020/042530
Publication Date:
May 20, 2021
Filing Date:
November 13, 2020
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
International Classes:
C08F222/10; C09J4/00; G03B17/00
Domestic Patent References:
| WO2019163629A1 | 2019-08-29 | |||
| WO2019185260A1 | 2019-10-03 |
Foreign References:
| EP2742108A1 | 2014-06-18 | |||
| CN109233648A | 2019-01-18 | |||
| JP2007184801A | 2007-07-19 | |||
| JP2017101112A | 2017-06-08 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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