Title:
THERMALLY-CONDUCTIVE ADDITION-CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/145438
Kind Code:
A1
Abstract:
The present invention pertains to a thermally-conductive addition-curable silicone composition characterized by comprising: (A) an organopolysiloxane that includes at least one aliphatic unsaturated hydrocarbon group per molecule and that has a kinematic viscosity of 60-100,000 mm2/s at 25°C; (B) a phenolic compound in an amount of 0.01-10 mass% with respect to the entirety of the composition; (C) a silver powder in an amount of 10-98 mass% with respect to the entirety of the composition; (D) an organohydrogen polysiloxane that has two or more hydrogen atoms bonded to silicon atoms per molecule, and that is contained in an effective amount that is enough for enabling the composition to form a cured product; and (E) an effective amount of a platinum group metal catalyst. Accordingly, provided is a thermally-conductive addition-curable silicone composition that has excellent heat dissipating ability.
Inventors:
KITAZAWA KEITA (JP)
IKENO MASAYUKI (JP)
HASEGAWA KOJI (JP)
NONAKA SHIORI (JP)
IKENO MASAYUKI (JP)
HASEGAWA KOJI (JP)
NONAKA SHIORI (JP)
Application Number:
PCT/JP2023/000506
Publication Date:
August 03, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08K3/08; C08K5/00; C08K5/13; C08L83/05
Domestic Patent References:
| WO2016017495A1 | 2016-02-04 | |||
| WO2021220724A1 | 2021-11-04 |
Foreign References:
| JP2004168920A | 2004-06-17 | |||
| CN109679352A | 2019-04-26 | |||
| JP2014218604A | 2014-11-20 | |||
| JPH07150048A | 1995-06-13 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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