Title:
COPPER-CLAD LAMINATE PLATE AND CIRCUIT BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/145439
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a laminate with which it is possible to reduce transmission loss and which is formed by laminating a low-roughness copper foil and a resin layer with an adhesive layer interposed therebetween, the resin layer comprising a polyarylene sulfide resin and having exceptional adhesiveness; and a circuit board in which the laminate is used. It was discovered that the aforementioned problem can be solved by laminating a low-roughness copper foil and a resin layer with an adhesive layer interposed therebetween, the resin layer having a polyarylene sulfide resin (A) as a main component and also comprising a thermoplastic resin (B) that has a glass transition temperature of 140°C or greater or a melting point of 230°C or greater and that is different from the polyarylene sulfide resin (A), whereupon the present invention was perfected.
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Inventors:
KOBASHI KAZUNORI (JP)
MITSUHASHI EIJI (JP)
YAMAGUCHI RYOTA (JP)
MITSUHASHI EIJI (JP)
YAMAGUCHI RYOTA (JP)
Application Number:
PCT/JP2023/000508
Publication Date:
August 03, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B27/00; B32B15/08; H05K1/03
Domestic Patent References:
| WO2006082902A1 | 2006-08-10 | |||
| WO2021100277A1 | 2021-05-27 | |||
| WO2020246459A1 | 2020-12-10 | |||
| WO2022149427A1 | 2022-07-14 |
Foreign References:
| JP2011253958A | 2011-12-15 |
Attorney, Agent or Firm:
ONO Takayuki (JP)
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