Title:
THERMALLY CONDUCTIVE ADHESIVE SHEET, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/103783
Kind Code:
A1
Abstract:
Provided are: a thermally conductive adhesive sheet enabling improvement of the dimensional precision of a high thermal conductivity part and a low thermal conductivity part of the thermally conductive adhesive sheet, reduction in thermal conductivity of the low thermal conductivity part, easy lamination on an electronic device without the need to interpose an adhesive layer, and enabling creation of a sufficient temperature difference within the electronic device; a method for manufacturing the thermally conductive adhesive sheet; and an electronic device using the thermally conductive adhesive sheet. The thermally conductive adhesive sheet comprises the high thermal conductivity part and the low thermal conductivity part, wherein: the high thermal conductivity part and the low thermal conductivity part are adhesive; the low thermal conductivity part contains 20-90 vol% of a hollow filler with respect to the total volume of the low thermal conductivity part; and the high thermal conductivity part or the low thermal conductivity part independently constitutes the total thickness of the thermally conductive adhesive sheet, or at least one of the two constitutes a portion of the thickness of the thermally conductive adhesive sheet.
Inventors:
MORITA WATARU (JP)
KATO KUNIHISA (JP)
MUTOU TSUYOSHI (JP)
KATO KUNIHISA (JP)
MUTOU TSUYOSHI (JP)
Application Number:
PCT/JP2015/073289
Publication Date:
June 30, 2016
Filing Date:
August 20, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B27/20; C09J7/10; C09J11/04; C09J11/06; C09J175/04; C09J183/04; C09J201/00; H01L23/36; H01L23/373; H01L35/30; H01L35/34; H02N3/00
Foreign References:
| JP2006526687A | 2006-11-24 | |||
| JP2008501848A | 2008-01-24 | |||
| JPH0782534A | 1995-03-28 | |||
| JPH01118584A | 1989-05-11 | |||
| JPH0326774A | 1991-02-05 | |||
| JP2013237778A | 2013-11-28 | |||
| JP2009542860A | 2009-12-03 | |||
| JP2000506925A | 2000-06-06 | |||
| JP2015054954A | 2015-03-23 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
Download PDF: