Title:
THERMALLY CONDUCTIVE ADHESIVE SHEET, PRODUCTION METHOD THEREFOR, AND ELECTRONIC DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/103784
Kind Code:
A1
Abstract:
The invention improves the dimensional accuracy for a high heat conduction portion and a low heat conduction portion of a thermally conductive adhesive sheet, and lowers the thermal conduction rate of the low heat conduction portion. Furthermore, the invention provides a thermally conductive adhesive sheet that is readily layered in an electronic device and capable of applying sufficient temperature difference inside the electronic device. The invention also provides a production method for the thermally conductive adhesive sheet and an electronic device using this sheet. The invention is the thermally conductive adhesive sheet comprising an adhesive layer and a base material that includes a high heat conduction portion and a low heat conduction portion, wherein: the adhesive layer is layered on a surface on one side of the base material; a hollow filler is included in the low heat conduction portion, at 20 to 90% by volume among the total volume of the low heat conduction portion; the surface on the other side of the base material is configured by the surface of the low heat conduction portion on the side that faces away from the surface in contact with the adhesive layer, and the surface of the high heat conduction portion on the side that faces away from the surface in contact with the adhesive layer; alternatively, the surface on the other side of the base material comprises at least one among the high heat conduction portion and the low heat conduction portion configuring a portion of the thickness of the base material. The invention is also a production method for the thermally conductive adhesive sheet and an electronic device using this sheet.
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Inventors:
KATO KUNIHISA (JP)
MORITA WATARU (JP)
MUTOU TSUYOSHI (JP)
KATSUTA YUMA (JP)
KONDO TAKESHI (JP)
MORITA WATARU (JP)
MUTOU TSUYOSHI (JP)
KATSUTA YUMA (JP)
KONDO TAKESHI (JP)
Application Number:
PCT/JP2015/073290
Publication Date:
June 30, 2016
Filing Date:
August 20, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/20; C09J7/20; C09J183/04; C09J201/00; H01L23/36; H01L35/30; H01L35/34; H02N3/00
Domestic Patent References:
| WO2013121486A1 | 2013-08-22 | |||
| WO2012070395A1 | 2012-05-31 |
Foreign References:
| JP2008182160A | 2008-08-07 | |||
| JP2004143270A | 2004-05-20 | |||
| JPH09124327A | 1997-05-13 | |||
| JP2007198806A | 2007-08-09 | |||
| JP2012044029A | 2012-03-01 | |||
| JP2009016812A | 2009-01-22 | |||
| JPH07111345A | 1995-04-25 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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