Title:
THERMALLY CONDUCTIVE COMPOSITION AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2023/153233
Kind Code:
A1
Abstract:
Provided is a thermally conductive composition that includes (A) 100 parts by mass of an organopolysiloxane that is represented by formula (1) and is a liquid at 23°C (in the formula, R is a hydrogen atom, an alkyl group, an aryl group, an aralkyl group, or an alkenyl group, X is a hydrogen atom or an alkyl group, a, b, c, and d are numbers that satisfy 0≤a≤0.8, 0≤b≤0.8, 0.2≤c≤1, 0≤d≤0.8, and a+b+c+d=1, and e is a number that satisfies 0≤e≤0.1) and (B) 2,000–7,000 parts by mass of a thermally conductive filler. The viscosity of the thermally conductive composition at 25°C is no more than 1,000 Pa⋅s.
Inventors:
TSUCHIDA KAZUHIRO (JP)
ENDO AKIHIRO (JP)
KIMURA TSUNEO (JP)
ENDO AKIHIRO (JP)
KIMURA TSUNEO (JP)
Application Number:
PCT/JP2023/002551
Publication Date:
August 17, 2023
Filing Date:
January 27, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/04; C08K3/013; C08K3/22; C08K3/28; C08K5/5419
Domestic Patent References:
| WO2021153683A1 | 2021-08-05 |
Foreign References:
| JP2018056567A | 2018-04-05 | |||
| JP2010120980A | 2010-06-03 | |||
| JP2012007057A | 2012-01-12 |
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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