Title:
THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE FILLER COMPOSITE BODY
Document Type and Number:
WIPO Patent Application WO/2023/120666
Kind Code:
A1
Abstract:
The present invention provides a thermally conductive composition which contains a matrix resin, a filler and an olefin wax. The olefin wax has a weight average molecular weight of 25,000 or less. The content ratio of the olefin wax relative to the total amount of the matrix resin, the filler and the olefin wax is more than 1% by mass.
Inventors:
KANAYA HIROTAKA (JP)
MURATA RYUNOSUKE (JP)
TAKAHASHI YOSUKE (JP)
KAWABE KUNIAKI (JP)
MURATA RYUNOSUKE (JP)
TAKAHASHI YOSUKE (JP)
KAWABE KUNIAKI (JP)
Application Number:
PCT/JP2022/047447
Publication Date:
June 29, 2023
Filing Date:
December 22, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08L101/00; C08K3/013; C08K3/22; C08L23/00; C08L77/00
Foreign References:
| JP2021138913A | 2021-09-16 | |||
| JP2007224265A | 2007-09-06 | |||
| JP2014231603A | 2014-12-11 |
Attorney, Agent or Firm:
IKUMI PATENT ATTORNEYS OFFICE (JP)
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