Title:
THERMALLY CONDUCTIVE COMPOSITION, THERMALLY CONDUCTIVE SHEET, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/162323
Kind Code:
A1
Abstract:
This thermally conductive composition contains a curing polyorganosiloxane (A) and a thermally conductive inorganic filler (B), wherein: 500-5000 parts by mass of the thermally conductive inorganic filler (B) is contained relative to 100 parts by mass of the curing polyorganosiloxane (A); the thermally conductive inorganic filler (B) contains spherical alumina (B1) having an average particle diameter of 1 µm or more and less than 10 µm, and crushed alumina (B2) having an average particle diameter of 0.01 µm or more and less than 1 µm; and the ratio of the spherical alumina (B1) having an average particle diameter of 1 µm or more and less than 10 µm relative to 100 parts by mass of the curing polyorganosiloxane (A) is more than 0 parts by mass and 1500 parts by mass or less, and the ratio of the crushed alumina (B2) having an average particle diameter of 0.01 µm or more and less than 1 µm is more than 0 parts by mass and 1000 parts by mass or less.
Inventors:
SUZUMURA KATSUYUKI
Application Number:
PCT/JP2022/037639
Publication Date:
August 31, 2023
Filing Date:
October 07, 2022
Export Citation:
Assignee:
FUJI POLYMER IND (JP)
International Classes:
C08L83/07; C08J5/18; C08K3/22; C08K3/28; C08K9/04; C08L83/05
Domestic Patent References:
| WO2018190233A1 | 2018-10-18 | |||
| WO2018131486A1 | 2018-07-19 | |||
| WO2020179115A1 | 2020-09-10 |
Foreign References:
| JP6246986B1 | 2017-12-13 | |||
| JP2017210518A | 2017-11-30 | |||
| JP2013147600A | 2013-08-01 | |||
| JP2010168558A | 2010-08-05 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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