Title:
THERMALLY CONDUCTIVE POLYMER COMPOSITION, MATERIAL FOR FORMING THERMALLY CONDUCTIVE POLYMER COMPOSITION, AND THERMALLY CONDUCTIVE POLYMER
Document Type and Number:
WIPO Patent Application WO/2023/182217
Kind Code:
A1
Abstract:
This thermally conductive polymer comprises a liquid rubber having two or more hydroxyl groups in each molecule, a solvent having one or more hydroxyl groups in each molecule, a hardener having, in each molecule, two or more functional groups reactive with both the hydroxyl groups of the liquid rubber and the hydroxyl groups of the solvent, and a filler having thermal conductivity.
Inventors:
NAKAHARA YUU (JP)
ASHIDA KEIKO (JP)
ASHIDA KEIKO (JP)
Application Number:
PCT/JP2023/010635
Publication Date:
September 28, 2023
Filing Date:
March 17, 2023
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C08L21/00; C08G18/69; C08G18/76; C08K3/013; C08L75/08
Foreign References:
| JP2012224832A | 2012-11-15 | |||
| JP2012224711A | 2012-11-15 | |||
| JP2014125522A | 2014-07-07 | |||
| JP2021107475A | 2021-07-29 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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