Title:
SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2023/182218
Kind Code:
A1
Abstract:
In a substrate treatment device (100), a control unit (102): calculates, on the basis of a measurement result of a first flowmeter (112b), a first supply amount of a first component liquid supplied from a first component liquid supply unit (112) to a storage tank (116) via a first pipe (112a); calculates, on the basis of a measurement result of a second flowmeter (114b), a second supply amount of a second component liquid supplied from a second component liquid supply unit (114) to the storage tank (116) via a second pipe (114a); and controls the first component liquid supply unit (112) and the second component liquid supply unit (114) on the basis of the first supply amount and the second supply amount during a component liquid supply period that is at least one period among a period during which the first component liquid supply unit (112) supplies a first component via the first pipe (112a) and a period during which the second component liquid supply unit (114) supplies a second component via the second pipe (114a)
Inventors:
AOKI RIKUTA (JP)
YAMAGUCHI TAKAHIRO (JP)
ENDO TORU (JP)
TSUZUKI RYOSUKE (JP)
UEMAE SHOJI (JP)
YAMAGUCHI TAKAHIRO (JP)
ENDO TORU (JP)
TSUZUKI RYOSUKE (JP)
UEMAE SHOJI (JP)
Application Number:
PCT/JP2023/010642
Publication Date:
September 28, 2023
Filing Date:
March 17, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/306; H01L21/304
Foreign References:
| JP2010232520A | 2010-10-14 | |||
| JP2008306089A | 2008-12-18 | |||
| JP2020198357A | 2020-12-10 |
Attorney, Agent or Firm:
MAEI Hiroyuki (JP)
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