Title:
THERMALLY-CONDUCTIVE POLYSILOXANE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/264715
Kind Code:
A1
Abstract:
Provided are: a thermally-conductive polysiloxane composition having high thermal conductivity and exceptional workability due to low viscosity; and a heat-dissipating material that uses the thermally-conductive polysiloxane composition. The thermally-conductive polysiloxane composition contains (A) a silver powder, (B) a polyorganosiloxane containing one or more aliphatic unsaturated groups in a molecule, (C) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to a silicon atom in a molecule, and (D) a platinum-based catalyst, wherein the component (A) includes (A-1) a flaky silver powder having a tapped density of 3.0 to 10.0 g/cm 3 and an average particle size of 1 to 20 μm, and (A-2) an agglomerated silver powder having a tapped density of 1.0 to 5.0 g/cm 3 and an average particle size of 1 to 10 μm, and the content ratio of component (A-1) and component (A-2) in 100 mass% of the thermally-conductive polysiloxane composition is 70 to 98 mass%.
Inventors:
IIDA ISAO (JP)
Application Number:
PCT/JP2022/019901
Publication Date:
December 22, 2022
Filing Date:
May 11, 2022
Export Citation:
Assignee:
MOMENTIVE PERFORMANCE MAT JP (JP)
International Classes:
C08L83/07; C08K3/08; C08L83/05; H01L23/373
Domestic Patent References:
| WO2017159252A1 | 2017-09-21 |
Foreign References:
| JP2018070800A | 2018-05-10 | |||
| JP2018123310A | 2018-08-09 | |||
| JP2013010862A | 2013-01-17 | |||
| JPH08208993A | 1996-08-13 | |||
| JP2009203373A | 2009-09-10 | |||
| JP2013225636A | 2013-10-31 | |||
| JP2002003831A | 2002-01-09 | |||
| JP2017066406A | 2017-04-06 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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