Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMALLY CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/054536
Kind Code:
A1
Abstract:
A thermally conductive sheet which comprises: a matrix that is formed of an organopolysiloxane; a thermally conductive filler that is contained in the matrix; methyl phenyl silicone; and a hydrocarbon compound that is in a liquid state at 25°C.

Inventors:
UMETANI HIROSHI (JP)
SEKI KAZUNORI (JP)
KANEKO TOSHIKI (JP)
Application Number:
PCT/JP2022/036313
Publication Date:
April 06, 2023
Filing Date:
September 28, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
H01L23/373; C08K3/013; C08K5/01; C08L83/04; C09K5/14
Foreign References:
JP2020007569A2020-01-16
JP2018065977A2018-04-26
JP2021090066A2021-06-10
JP2002129019A2002-05-09
JP2021086887A2021-06-03
JP2020128463A2020-08-27
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: INFORMATION PROCESSING DEVICE, ROBOT CONTROLLER, ROBOT CONTROL SYSTEM, AND INFORMATION PROCESSING ME...

Next Patent: PRODUCTION METHOD AND PRODUCTION SYSTEM FOR NON-FUNGIBLE TOKEN, REGISTRATION METHOD AND SYSTEM FOR U...