Title:
THERMALLY CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/100818
Kind Code:
A1
Abstract:
Provided is a thermally conductive sheet that has favorable thermal conductivity and that also has high transparency. The thermally conductive sheet comprises a resin layer containing a resin and a thermally conductive filler, wherein: the total light transmittance of the resin layer is at least 85%; the refractive index np of the resin is no more than 1.469; and a value (np-nf) obtained by subtracting the refractive index nf of the thermally conductive filler from the refractive index np of the resin is －0.01 to 0.01.
Inventors:
OZAKI MAYU (JP)
MIZUNO DAISUKE (JP)
FUKUTOMI SHUHEI (JP)
MIZUNO DAISUKE (JP)
FUKUTOMI SHUHEI (JP)
Application Number:
PCT/JP2022/043817
Publication Date:
June 08, 2023
Filing Date:
November 28, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L23/36; C08F220/22; C08J5/18; C08K3/01; C08L101/00; C09J7/38; C09J11/04; C09J201/00; C09K5/14; H01L23/373; H05K7/20
Foreign References:
| JP2020023672A | 2020-02-13 | |||
| JP2016204523A | 2016-12-08 | |||
| JP2021090066A | 2021-06-10 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
Download PDF:
Previous Patent: THERMALLY CONDUCTIVE SHEET
Next Patent: SELF-PROPELLED ROBOT AND METHOD FOR MANUFACTURING STRUCTURE
Next Patent: SELF-PROPELLED ROBOT AND METHOD FOR MANUFACTURING STRUCTURE