Title:
THERMALLY CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/100817
Kind Code:
A1
Abstract:
Provided is a thermally conductive sheet provided with high transparency while having good thermal conductivity. Provided is a thermally conductive sheet comprising a resin layer including a resin and a thermally conductive filler, wherein the resin includes a fluorine-based polymer, the thermally conductive filler includes a silicon-atom-containing filler, and the value (np – nf) obtained by subtracting the refractive index nf of the thermally conductive filler from the refractive index np of the resin is -0.01 to 0.01.
Inventors:
OZAKI MAYU (JP)
MIZUNO DAISUKE (JP)
FUKUTOMI SHUHEI (JP)
MIZUNO DAISUKE (JP)
FUKUTOMI SHUHEI (JP)
Application Number:
PCT/JP2022/043816
Publication Date:
June 08, 2023
Filing Date:
November 28, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08J5/18; C08F220/22; C08K3/36; C08L27/12; C09J7/38; C09J11/04; C09J201/04; H01L23/373; H05K7/20
Domestic Patent References:
| WO2021235460A1 | 2021-11-25 |
Foreign References:
| JP2012229316A | 2012-11-22 | |||
| JP2020023672A | 2020-02-13 | |||
| JPH10182746A | 1998-07-07 | |||
| JP2021001266A | 2021-01-07 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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