Title:
THERMALLY CONDUCTIVE SILICONE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/149431
Kind Code:
A1
Abstract:
This thermally conductive silicone adhesive composition comprises: (A) an organopolysiloxane which has an alkenyl group and does not have an organoxysilyl group; (B) an organopolysiloxane blocked with trialkoxysilyl groups at both terminals; (C) an organopolysiloxane blocked with an alkoxy group at one terminal; (D) a predetermined cyclic organohydrogensiloxane; (E) a predetermined linear organohydrogen polysiloxane; (F) a thermally conductive filling material; and (G) a platinum group metal-based catalyst, wherein [total number of Si-H groups]/[total number of alkenyl groups] is a predetermined ratio, and [number of Si-H groups in (D) component]/[number of Si-H groups in (E) component] is a predetermined ratio.
Inventors:
MATSUMOTO NOBUAKI (JP)
SAKAMOTO AKIRA (JP)
KITAGAWA TAICHI (JP)
SAKAMOTO AKIRA (JP)
KITAGAWA TAICHI (JP)
Application Number:
PCT/JP2020/047621
Publication Date:
July 29, 2021
Filing Date:
December 21, 2020
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C09J9/00; C08K3/013; C08L83/05; C08L83/06; C08L83/07; C09J11/04; C09J11/06; C09J183/05; C09J183/06; C09J183/07
Domestic Patent References:
| WO2015155950A1 | 2015-10-15 | |||
| WO2010032870A1 | 2010-03-25 | |||
| WO2007032481A1 | 2007-03-22 |
Foreign References:
| JP2012067153A | 2012-04-05 | |||
| JP2011122000A | 2011-06-23 | |||
| JP2018009127A | 2018-01-18 | |||
| JP2018193491A | 2018-12-06 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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