Title:
THERMALLY CONDUCTIVE SILICONE ADHESIVE COMPOSITION AND THERMALLY CONDUCTIVE COMPLEX
Document Type and Number:
WIPO Patent Application WO/2023/090049
Kind Code:
A1
Abstract:
[Problem] The present invention addresses the problem of providing a thermally conductive silicone adhesive composition that has satisfactory handling properties and can achieve sufficient adhesion strength. The present invention also addresses the problem of providing a complex having excellent strength and insulation properties. [Solution] Provided is a thermally conductive silicone adhesive composition comprising the following components (a) to (e): (a) a linear or branched organopolysiloxane in an amount of 100 parts by mass; (b) a thermally conductive filler in an amount of 1,500 to 7,500 parts by mass; (c) a three-dimensional net-like organopolysiloxane resin comprising the following components (c-1) and (c-2), in an amount of 150 to 600 parts by mass: (c-1): a three-dimensional net-like organopolysiloxane resin represented by general formula (1) (wherein R1's independently represent a group selected from an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms and an aralkyl group having 7 to 10 carbon atoms; R2 represents an alkenyl group having 2 to 8 carbon atoms; and a1, b1, c1, d1 and e1 respectively represent a numerical value satisfying the formula 0 < a1 ≤ 100, a numerical value satisfying the formula 0 < b1 ≤ 100, a numerical value satisfying the formula 0 ≤ c1 ≤ 100, a numerical value satisfying the formula 0 ≤ d1 ≤ 100 and a numerical value satisfying the formula 0 ≤ e1 ≤ 100 and satisfy the ranges represented by the formulae 0 < d1+e1 and 0.5 ≤ a1/(d1+e1) ≤ 2), in which the amount of the alkenyl groups in the molecule thereof is 0.05 to 0.15 mol/100 g; (c-2): a three-dimensional net-like organopolysiloxane resin represented by general formula (2) (wherein R1's independently represent a group selected from an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms and an aralkyl group having 7 to 10 carbon atoms; and a2, c2, d2 and e2 respectively represent a numerical value satisfying the formula 0 < a2 ≤ 100, a numerical value satisfying the formula 0 ≤ c2 ≤100, a numerical value satisfying the formula 0 ≤ d2 ≤ 100, and a numerical value satisfying the formula 0 < e2 ≤ 100 and satisfy the range represented by the formula 0.7 ≤ a2/e2 ≤ 2.5); (d) an organohydrogenpolysiloxane having at least two hydrosilyl groups per molecule in an amount of 1 to 25 parts by mass; and (e) an organic peroxide in an amount of 5 to 50 parts by mass.
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Inventors:
ITO TAKANORI (JP)
Application Number:
PCT/JP2022/039251
Publication Date:
May 25, 2023
Filing Date:
October 21, 2022
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
B32B27/00; B32B7/027; B32B27/20; C09J7/20; C09J7/30; C09J11/04; C09J11/06; C09J183/04; C09J183/05; C09J183/07
Domestic Patent References:
| WO2019142688A1 | 2019-07-25 | |||
| WO2020032287A1 | 2020-02-13 |
Foreign References:
| JP2020180186A | 2020-11-05 | |||
| JP2017088853A | 2017-05-25 | |||
| JP2004233455A | 2004-08-19 | |||
| JP2010202728A | 2010-09-16 |
Attorney, Agent or Firm:
MURAKAMI Hiroshi et al. (JP)
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