Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND THERMALLY CONDUCTIVE MEMBER
Document Type and Number:
WIPO Patent Application WO/2022/075434
Kind Code:
A1
Abstract:
This thermally conductive silicone composition is constituted of at least: (A) an organopolysiloxane having an average of at least 2 alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having an average of at least two silicon atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler comprising (D-1) a thermally conductive powder other than an aluminum nitride powder, which has an average particle diameter of not less than 0.1 µm and less than 5 µm, (D-2) an aluminum nitride powder having an average particle diameter of not less than 20 µm and less than 80 µm, and (D-3) a spherical aluminum oxide powder and/or spherical magnesium oxide powder having an average particle diameter of not less than 80 µm; and (E) a specific surface treatment agent or wetting agent. This composition exhibits good handling properties and filling properties and, when cured, forms a thermally conductive member which exhibits high thermal conductivity and in which the occurrence of internal cracks at high temperatures is suppressed.
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Inventors:
OTA KENJI (JP)
Application Number:
PCT/JP2021/037267
Publication Date:
April 14, 2022
Filing Date:
October 08, 2021
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08K5/5419; C08K3/013; C08K3/28; C08K7/18; C08K13/04; C08L83/05; C08L83/07
Domestic Patent References:
| WO2015087620A1 | 2015-06-18 | |||
| WO2020203299A1 | 2020-10-08 | |||
| WO2019021824A1 | 2019-01-31 | |||
| WO2018074247A1 | 2018-04-26 | |||
| WO2020137086A1 | 2020-07-02 |
Foreign References:
| JP2017210518A | 2017-11-30 | |||
| JP2016216523A | 2016-12-22 | |||
| JP2002003831A | 2002-01-09 | |||
| JP2013147600A | 2013-08-01 | |||
| JP2014503680W |
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