Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/077435
Kind Code:
A1
Abstract:
A thermally conductive silicone composition comprises: (A) an organopolysiloxane having at least one alkenyl group with 2 to 12 carbon atoms per molecule and having a viscosity at 25 ℃ of from 10 to 10,000 mPa·s; (B) a hydrophobic fumed silica; (C) at least one thermally conductive filler; and (D) at least one polyether selected from a group consisting of (D 1) a polytetramethylene ether glycol, (D 2) an alcohol initiated ethylene oxide and propylene oxide copolymer, and (D 3) a polyether-modified organopolysiloxane. The composition exhibits good shape-holding property and high thermal conductivity despite good handleability and dispensabillity.
Inventors:
HUANG YAN (CN)
BHAGWAGAR DORAB (US)
CAO ZHONGWEI (CN)
ZHANG KAINAN (CN)
BHAGWAGAR DORAB (US)
CAO ZHONGWEI (CN)
ZHANG KAINAN (CN)
Application Number:
PCT/CN2022/124318
Publication Date:
April 18, 2024
Filing Date:
October 10, 2022
Export Citation:
Assignee:
DOW SILICONES CORP (US)
HUANG YAN (CN)
BHAGWAGAR DORAB (US)
CAO ZHONGWEI (CN)
ZHANG KAINAN (CN)
HUANG YAN (CN)
BHAGWAGAR DORAB (US)
CAO ZHONGWEI (CN)
ZHANG KAINAN (CN)
International Classes:
C08L83/04; H01L23/373
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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