THERMOCONDUCTIVE MEMBER AND ELECTRONIC COMPONENT

WIPO Patent Application WO/2017/006460

A1

Provided are: a thermoconductive member that has a combination of properties including (A) having high thermoconductivity, (B) adaptability to the irregularities in the surface of an electronic component and the surface of a heat-dissipating member, and (C) having little lateral protrusion; and an electronic component on which a heat-dissipating member is disposed with the thermoconductive member interposed therebetween. This thermoconductive member includes an adhesive and a metal structure having through-holes, wherein the adhesive is included in the through-holes of the metal structure, and an adhesive layer 0.5-15 μm in thickness is formed on the surface of the metal structure through which the through-holes pass.

WO/2005/034236	PLASTICALLY DEFORMABLE COOLING BODY FOR ELECTRIC AND/OR ELECTRONIC COMPONENTS
JPH0567697	RESIN SEALED-TYPE SEMICONDUCTOR DEVICE
WO/2002/081592	EXTRUDABLE BRIDGED GREASE-LIKE HEAT RADIATING MATERIAL, CONTAINER SEALINGLY FILLED WITH THE MATERIAL, METHOD OF MANUFACTURING THE CONTAINER, AND METHOD OF RADIATING HEAT BY THE USE THEREOF

INADA TEIICHI (JP)
HIROYAMA YUKIHISA (JP)
TATENO KIICHI (JP)
ITO TOMOYOSHI (JP)
OBATA KAZUHITO (JP)
MATSUURA YOSHITSUGU (JP)
NAKANO YUTA (JP)

PCT/JP2015/069648

January 12, 2017

July 08, 2015

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HITACHI CHEMICAL CO LTD (JP)

H01L23/373; C09J7/20; C09J9/00; C09J133/00; C09J161/04; C09J163/00; C09J183/04; C09J201/00; H01L23/36

JP2005235968A	2005-09-02
JP2013039834A	2013-02-28

OHTANI, Tamotsu et al. (JP)

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