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Patent Searching and Data


Title:
THERMOELECTRIC CONVERSION MODULE, HEAT-CONDUCTIVE LAMINATE, THERMOELECTRIC CONVERSION MODULE MANUFACTURING METHOD, AND HEAT-CONDUCTIVE LAMINATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/110879
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a thermoelectric conversion module which has a bellows shape, and has good structural stability and handleability and good flexibility as a result of combination of an insulating member, a heat dissipating member, etc.; a heat-conductive laminate to be used in this thermoelectric conversion module; and a method of manufacturing same. The problem is solved by comprising: a module main unit including a support body in a bellows shape, thermoelectric conversion layers formed on the support body and separated from each other, and a connection electrode which connects adjacent ones of the thermoelectric conversion layers; one or more bellows-shaped members provided so that projections and recesses thereof fit to the module main unit; and a flexible linear member that penetrates bellows-shaped inclined surfaces of the module main unit and bellows-shaped inclined surfaces of the one or more bellows-shaped members so as to be inserted through the module main unit and through the one or more bellows-shaped members.

Inventors:
IMAI SHINJI (JP)
SUZUKI HIDEYUKI (JP)
Application Number:
PCT/JP2016/088117
Publication Date:
June 29, 2017
Filing Date:
December 21, 2016
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L35/32; H01L35/34; H02N11/00
Foreign References:
JP2008205129A2008-09-04
JP2008130813A2008-06-05
JP2003318456A2003-11-07
JP2003315163A2003-11-06
JPH06151979A1994-05-31
US20140318591A12014-10-30
US20110220162A12011-09-15
JPH05168846A1993-07-02
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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