THERMOELECTRIC MATERIAL AND PREPARATION METHOD THEREFOR

Title:

THERMOELECTRIC MATERIAL AND PREPARATION METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2020/149464

Kind Code:

A1

Abstract:

The present invention relates to a thermoelectric material and, specifically, to a thermoelectric material capable of improving the figure of merit and a preparation method therefor. In the present invention, the thermoelectric material may comprise: a matrix compound having a composition of chemical formula 1 or 2; and particles having a composition of chemical formula 3 dispersed in the matrix compound. (AB 2) x(Bi 2Se 2.7Te 0.3) 1-x,, (CB) x(Bi 2Se 2.7Te 0.3) 1-x, D yE z.

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Inventors:

LIM JONGRAE (KR)
KIM JUN (KR)
PARK JOOYOUNG (KR)
SON JEONGHUN (KR)
JANG YOUNGIL (KR)

Application Number:

PCT/KR2019/006967

Publication Date:

July 23, 2020

Filing Date:

June 11, 2019

Export Citation:

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Assignee:

LG ELECTRONICS INC (KR)

International Classes:

H01L35/16; H01L35/18; H01L35/34

Foreign References:

KR20130006039A	2013-01-16
US20110248210A1	2011-10-13

Other References:

LIU, YAOCHUN ET AL.: "Enhanced thermoelectric performance of BiCuSeO composites with nano inclusion of copper selenides", JOURNAL OF ALLOYS AND COMPOUNDS, vol. 662, 25 March 2016 (2016-03-25), pages 320 - 324, XP029385639
LI, MENG ET AL.: "Significantly enhanced figure-of-merit in graphene nanoplate incorporated Cu2Se fabricated by spark plasma sintering", JOURNAL OF ALLOYS AND COMPOUNDS, vol. 769, 15 November 2018 (2018-11-15), pages 59 - 64, XP085506723, DOI: 10.1016/j.jallcom.2018.07.353
LOGNONE, QUENTIN ET AL.: "Reactivity, stability and thermoelectric properties of n-Bi2Te3 doped with different copper amounts", JOURNAL OF ALLOYS AND COMPOUNDS, vol. 610, 15 October 2014 (2014-10-15), pages 1 - 5, XP028874442, DOI: 10.1016/j.jallcom.2014.04.166

Attorney, Agent or Firm:

PARK, Jang-Won (KR)

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