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Title:
THERMOELECTRIC MODULE AND METHOD FOR ADJUSTING THERMOELECTRIC MODULE
Document Type and Number:
WIPO Patent Application WO/2020/137244
Kind Code:
A1
Abstract:
This thermoelectric module (2) is provided with: a substrate (21); a plurality of electrodes (23) arranged on the surface (21S) of the substrate; a plurality of thermoelectric elements (25) connected to the plurality of electrodes, respectively; and at least three terminals (81, 82, 83) connected to different electrodes, respectively, and to one or both of a first load (7) and a second load (6).

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Inventors:
KISHIZAWA TOSHIHIKO (JP)
FUJIMOTO SHINICHI (JP)
Application Number:
PCT/JP2019/044977
Publication Date:
July 02, 2020
Filing Date:
November 15, 2019
Export Citation:
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Assignee:
KELK LTD (JP)
International Classes:
H01L35/32; H01L35/28; H02N11/00
Domestic Patent References:
WO2018174173A12018-09-27
Foreign References:
JP2007150231A2007-06-14
JP2016015861A2016-01-28
JPH03181185A1991-08-07
JP2005251950A2005-09-15
JP2005117835A2005-04-28
US20130239591A12013-09-19
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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