Title:
THERMOPLASTIC RESIN COMPOSITION FOR ELECTROMAGNETIC WAVE ABSORBER AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2024/029312
Kind Code:
A1
Abstract:
One embodiment of the present invention relates to a thermoplastic resin composition for an electromagnetic wave absorber, said composition comprising a thermoplastic resin (A), carbon nanotubes (B) having an average diameter of 1-15 nm, and carbon black (C) having an average primary particle size of 20-50 nm, wherein one of (i)-(iv) is satisfied, and ΔRL expressed by formula (1) is 3 dB or less and ΔTL expressed by formula (2) is 5 dB or less.
Inventors:
KOBAYASHI YUTA (JP)
OKAWA MOE (JP)
OKAWA MOE (JP)
Application Number:
PCT/JP2023/025935
Publication Date:
February 08, 2024
Filing Date:
July 13, 2023
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
TOYOCOLOR CO LTD (JP)
TOYOCOLOR CO LTD (JP)
International Classes:
C08L101/00; C08J5/18; C08K3/04; C08K7/06; H01Q17/00; H05K9/00
Foreign References:
| JP2016108524A | 2016-06-20 | |||
| JP2018028031A | 2018-02-22 | |||
| JP2016504471A | 2016-02-12 | |||
| JP2019176143A | 2019-10-10 | |||
| JP2017095525A | 2017-06-01 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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