Title:
COMPOSITE MATERIAL, HEAT SPREADER, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/029311
Kind Code:
A1
Abstract:
This composite material is plate-shaped and has a first surface and a second surface that is a surface opposite to the first surface. The composite material comprises a plurality of first layers and at least one second layer. The first surface and the second surface each form an end surface in the thickness direction of the composite material. The first layers and the second layer are alternately laminated along the thickness direction such that the first layers are located in the first surface and the second surface. The first layers are each formed from a metal material including copper as a main component. The second layer has a molybdenum sheet and a copper filler. The molybdenum sheet has formed therein a plurality of openings that penetrate through the molybdenum sheet along the thickness direction. The copper filler is arranged inside the openings. In a cross-sectional view orthogonal to the thickness direction, the openings are arrayed so as to form a lattice arrangement.
Inventors:
SASAKI KEITA (JP)
MAEDA TORU (JP)
KONDO DAISUKE (JP)
ITO MASAYUKI (JP)
YAMAGATA SHIN-ICHI (JP)
MAEDA TORU (JP)
KONDO DAISUKE (JP)
ITO MASAYUKI (JP)
YAMAGATA SHIN-ICHI (JP)
Application Number:
PCT/JP2023/025926
Publication Date:
February 08, 2024
Filing Date:
July 13, 2023
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
ALMT CORP (JP)
ALMT CORP (JP)
International Classes:
H01L23/36; B32B15/01; H05K7/20
Domestic Patent References:
| WO2018020695A1 | 2018-02-01 |
Foreign References:
| JP2010245496A | 2010-10-28 | |||
| JPH0313331A | 1991-01-22 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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