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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION, AND MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/004603
Kind Code:
A1
Abstract:
The present invention provides a resin composition which has sufficiently excellent flowability and from which a molded product having sufficiently excellent mechanical properties, heat resistance, dimensional stability, impact resistance, dust resistance, and appearance, can be molded. The present invention relates to a thermoplastic resin composition comprising: 5-58 mass% of polycarbonate resin (A); 15-50 mass% of polyphenylene ether resin (B); 0.5-12 mass% of polystyrene resin (C); and 0.5-5 mass% of styrene elastomer (D), wherein the total of the components (A)-(D) is 100 mass%.

Inventors:
KAMIKAWA HIROO (JP)
Application Number:
PCT/JP2023/021673
Publication Date:
January 04, 2024
Filing Date:
June 12, 2023
Export Citation:
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Assignee:
UNITIKA LTD (JP)
International Classes:
C08L69/00; C08L25/06; C08L53/02; C08L71/12
Foreign References:
CN103304975A2013-09-18
CN105440628A2016-03-30
JPS63199267A1988-08-17
JPH02284945A1990-11-22
JPH03197554A1991-08-28
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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