Title:
FILM, METHOD FOR PRODUCING SAME, METAL CLAD LAMINATED BOARD, CIRCUIT BOARD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/004604
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing, for example, a film that reduces dielectric loss and is excellent in adhesiveness with a copper foil layer. The film according to the present invention contains a resin and a filler, the film being characterized in that: the dielectric dissipation factors in a frequency of 28 GHz of the resin and the filler in an environment of 22°C and 60% RH are both 0.0150 or less; the content of the filler falls within the range of 1.0%-70.0% by mass based on the total mass of the film; and when the quantities of surface free energy of two facing surfaces of the film are denoted as A [mJ/m2] and B [mJ/m2], respectively, the following expressions are satisfied. (Expression 1): A ≤ B (Expression 2): 1 ≤ B/A < 1.30
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Inventors:
TAKAMA MANAMI (JP)
OKUBO YASUSHI (JP)
XU NAIAO (JP)
NISHIMURA HIROSHI (JP)
OKUBO YASUSHI (JP)
XU NAIAO (JP)
NISHIMURA HIROSHI (JP)
Application Number:
PCT/JP2023/021676
Publication Date:
January 04, 2024
Filing Date:
June 12, 2023
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
C08L101/00; B32B27/00; H05K1/03
Domestic Patent References:
| WO2016159060A1 | 2016-10-06 |
Foreign References:
| JP2021161185A | 2021-10-11 | |||
| JP2021195446A | 2021-12-27 | |||
| JP2022126429A | 2022-08-30 |
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
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