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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/176788
Kind Code:
A1
Abstract:
[Problem] To provide a thermoplastic resin composition having excellent flexibility and excellent mechanical strength with a good balance therebetween. [Solution] A thermoplastic resin composition comprising: 100 parts by mass of a thermoplastic resin which is a product of hydrogenation of a block copolymer comprising a polymer block (X) consisting mainly of a vinyl aromatic compound and a polymer block (Y) consisting mainly of a conjugated diene compound; and 1-400 parts by mass of a modified ethylene/α-olefin copolymer satisfying the following requirements (b-1) to (b-3). Requirement (b-1): To have a content of ethylene-derived structural units of 15-85 mol%. Requirement (b-2): To have a weight-average molecular weight of 1,000-100,000. Requirement (b-3): To be a modified copolymer having substituents derived from one or more vinyl aromatic compounds, wherein the content of moieties derived from the one or more vinyl aromatic compounds is 1-70 mass%.

Inventors:
YOSHIDA YUTO (JP)
SHIMAMURA TAKEHIKO (JP)
Application Number:
PCT/JP2023/009685
Publication Date:
September 21, 2023
Filing Date:
March 13, 2023
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08L53/02; C08F4/6592; C08F8/00; C08L23/26; C08L101/00; C09D123/16; C09D123/26; C09D153/00; C09J123/16; C09J153/00; C09K3/10
Domestic Patent References:
WO2015147215A12015-10-01
WO2018159483A12018-09-07
WO2016181641A12016-11-17
WO2022186053A12022-09-09
Foreign References:
JP2016222885A2016-12-28
JP2019156873A2019-09-19
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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