Title:
THERMOSETTING ELECTRICALLY CONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2018/047597
Kind Code:
A1
Abstract:
In the past, for many types of thermosetting curable resins, it was difficult to achieve an electrically conductive adhesive that would reduce connection resistance when the adherend was nickel, etc. In addition to reducing connection resistance when the adherend is nickel, etc. for many types of thermosetting curable resins, the present invention makes possible an electrically conductive adhesive for which storage stability is also maintained and which is easy to handle. The present invention is a thermosetting electrically conductive adhesive comprising components (A)-(D):
Component (A): curable resin
Component (B): thermosetting agent for curing component (A)
Component (C): organic metal complex
Component (D): electrically conductive particles
Inventors:
OTA SOICHI (JP)
MAFUNE HITOSHI (JP)
KATO MAKOTO (JP)
KODAMA TOMOYA (JP)
MAFUNE HITOSHI (JP)
KATO MAKOTO (JP)
KODAMA TOMOYA (JP)
Application Number:
PCT/JP2017/029567
Publication Date:
March 15, 2018
Filing Date:
August 17, 2017
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C09J201/00; C09J4/02; C09J9/02; C09J11/04; C09J11/06; C09J163/00; H01B1/00; H01B1/20
Domestic Patent References:
| WO2016125644A1 | 2016-08-11 |
Foreign References:
| JP2013253151A | 2013-12-19 | |||
| JP2016060761A | 2016-04-25 | |||
| JP2015054942A | 2015-03-23 | |||
| JP2016048807A | 2016-04-07 | |||
| JP2012046757A | 2012-03-08 | |||
| JP2008288601A | 2008-11-27 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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