Title:
THERMOSETTING ELECTROCONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2018/047598
Kind Code:
A1
Abstract:
In the past, it was necessary to add many electroconductive particles in order to improve electroconductivity, and adding many particles caused the initial viscosity to rise and made it difficult to stabilize storage stability. In the present invention, however, selecting monomers makes it possible to improve the electroconductivity even if many electroconductive particles are not added, and using specific electroconductive particles makes it possible to stabilize the storage stability. A thermosetting electroconductive adhesive including components (A)-(D); component (A): an oligomer having (meth)acryl groups, component (B): monomers having one methacryl group in the molecule, component (C): an organic peroxide having a specific structure, component (D): electroconductive particles surface-treated by stearic acid.
Inventors:
KODAMA TOMOYA (JP)
OTA SOICHI (JP)
OSADA MASAYUKI (JP)
MAFUNE HITOSHI (JP)
KATO MAKOTO (JP)
MORII KANAKO (JP)
OTA SOICHI (JP)
OSADA MASAYUKI (JP)
MAFUNE HITOSHI (JP)
KATO MAKOTO (JP)
MORII KANAKO (JP)
Application Number:
PCT/JP2017/029568
Publication Date:
March 15, 2018
Filing Date:
August 17, 2017
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C09J4/02; C09J9/02; C09J11/04; C09J11/06; H01B1/00; H01B1/20
Foreign References:
| JP2016117860A | 2016-06-30 | |||
| JP2015135805A | 2015-07-27 | |||
| JP2013253152A | 2013-12-19 | |||
| JP2004018715A | 2004-01-22 | |||
| JP2013098230A | 2013-05-20 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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