Title:
THERMOSETTING FILM, COMPOSITE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/058302
Kind Code:
A1
Abstract:
A thermosetting film wherein the shear strength of a first test piece comprising a cured product of the thermosetting film, a copper plate provided to all of one surface of the cured product, and a silicon chip provided to all of the other surface of the cured product is 100 N/2mm □ or more, and when the melt viscosity V0 at a temperature of 90ºC of a second test piece obtained by storing the thermosetting film for 168 hours at 5ºC is measured and the melt viscosity V1 at a temperature of 90ºC of a third test piece obtained by storing the thermosetting film for 504 hours at 40ºC is measured, the melt viscosity increase rate VR of the thermosetting film calculated using V1 and V0 is 600% or less.
Inventors:
ADACHI ISSEI (JP)
NANASHIMA YUTAKA (JP)
NANASHIMA YUTAKA (JP)
Application Number:
PCT/JP2022/028934
Publication Date:
April 13, 2023
Filing Date:
July 27, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/52; H01L21/301
Domestic Patent References:
| WO2020196138A1 | 2020-10-01 |
Foreign References:
| JP2013053190A | 2013-03-21 | |||
| JP2011103440A | 2011-05-26 | |||
| JP2018123253A | 2018-08-09 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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