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Title:
THERMOSETTING FILM, COMPOSITE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/058303
Kind Code:
A1
Abstract:
A thermosetting film containing a binder (a), an epoxy resin (b1), a thermosetting agent (b2), a curing accelerator (c), and a layered compound (z), wherein the curing accelerator (c) is supported on the layered compound (z), forming a curing accelerator composite body (y).

Inventors:
ADACHI ISSEI (JP)
NANASHIMA YUTAKA (JP)
Application Number:
PCT/JP2022/029093
Publication Date:
April 13, 2023
Filing Date:
July 28, 2022
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; C09J7/35; C09J11/04; C09J163/00; H01L21/52; H01L23/29; H01L23/31
Domestic Patent References:
WO2020226077A12020-11-12
Foreign References:
JP2018123253A2018-08-09
JP2018171864A2018-11-08
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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