THERMOSETTING RESIN COMPOSITION, CURED FILM THEREOF, LAYERED PRODUCT, SEMICONDUCTOR DEVICE AND METHODS FOR PRODUCING THESE

WIPO Patent Application WO/2019/013240

A1

Provided are: a thermosetting resin composition which is excellent in terms of suppressing fluctuations over time in the thickness of a film formed from the thermosetting resin composition and which is excellent in terms of strength upon formation of a cured film; a cured film of the composition; a layered product; a semiconductor device; and methods for producing these. This thermosetting resin composition contains: a polymer precursor selected from between a polyimide precursor and a polybenzoxazole precursor; a salt containing a cation derived from an amine compound and an anion derived from an acidic compound; and a solvent. The pKa value of a conjugate acid of the amine compound and the pKa value of the acidic compound satisfy numerical formula 1. Numerical formula 1: 3.5 ≤ (pKa value of conjugate acid of amine compound + pKa value of the acidic compound) / 2 ≤ 7.1

JP2551196	[Title of Invention] Transfer Sheet for Injection Molded Printed Circuit Board
JPH07232402	LAMINATE AND MANUFACTURE THEREOF
JP3299501	PLATE FOR LAMINATED PLATE MOLDING AND LAMINATED PLATE

YOSHIDA KENTA (JP)
KAWABATA TAKESHI (JP)
IWAI YU (JP)
SHIBUYA AKINORI (JP)

PCT/JP2018/026134

January 17, 2019

July 11, 2018

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FUJIFILM CORP (JP)

B32B15/08; C08L79/08; B32B27/00; B32B27/34; C08G73/10; C08K5/09; C08K5/17; C08K5/42; G03F7/004; G03F7/027; G03F7/031; G03F7/20; G03F7/40; H01L23/12

WO2017104672A1	2017-06-22
WO2006057036A1	2006-06-01

JP2004091572A	2004-03-25
JP2015108053A	2015-06-11
JPH09316200A	1997-12-09
JP2003084434A	2003-03-19
JP2001264715A	2001-09-26
JP2014122279A	2014-07-03

SIKS & CO. (JP)

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