Title:
THERMOSETTING RESIN COMPOSITION, CURED FILM, AND NONAQUEOUS DISPERSION RESIN PARTICLES
Document Type and Number:
WIPO Patent Application WO/2020/217320
Kind Code:
A1
Abstract:
[Problem] To provide a thermosetting resin composition which has good curability, can be used for various applications, uses transesterification as the curing reaction, and has good physical properties. [Solution] A thermosetting resin composition which comprises a resin component (A) which has, as an essential component, a film property modifier (A-1) which is at least one selected from the group consisting of nonaqueous dispersion resin particles, a block copolymer, and a polyester resin, the resin component (A) having an alkyl ester group and a hydroxyl group, the thermosetting resin composition further comprising a transesterification catalyst (B).
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Inventors:
MORIWAKI YUYA (JP)
ASADA KOSUKE (JP)
DONKAI MASARU (JP)
TAKENAKA NAOMI (JP)
ASADA KOSUKE (JP)
DONKAI MASARU (JP)
TAKENAKA NAOMI (JP)
Application Number:
PCT/JP2019/017284
Publication Date:
October 29, 2020
Filing Date:
April 23, 2019
Export Citation:
Assignee:
KYOEISHA CHEMICAL CO LTD (JP)
International Classes:
C08F290/12; C08L101/00; C08K5/00; C08L33/04; C08L67/00
Domestic Patent References:
| WO2019054136A1 | 2019-03-21 |
Foreign References:
| JPH02147675A | 1990-06-06 | |||
| JP2003261733A | 2003-09-19 | |||
| JPH06157618A | 1994-06-07 | |||
| JPH0892503A | 1996-04-09 | |||
| JP2001261715A | 2001-09-26 |
Attorney, Agent or Firm:
TASS MEISTER PATENT FIRM (JP)
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