Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION, DIELECTRIC SUBSTRATE, AND MICROSTRIP ANTENNA
Document Type and Number:
WIPO Patent Application WO/2022/202804
Kind Code:
A1
Abstract:
A thermosetting resin composition of the present invention comprises a thermosetting resin (A) and a high-dielectric constant filler (C). The high-dielectric constant filler (C) includes at least one selected from calcium titanate, strontium titanate, magnesium titanate, magnesium zirconate, strontium zirconate, bismuth zirconate, bismuth titanate, zirconium titanate, zinc titanate, barium zirconate, calcium zirconate titanate, lead zirconate titanate, barium magnesium niobate, and calcium zirconate.

More Like This:
JP2004123742METHOD FOR MANUFACTURING BENZOXAZINE COMPOUND
JP2020204014EPOXY RESIN SOLUTION
JP6965944Thermosetting composition, thermosetting resin modifier, cured product thereof, semiconductor encapsulant material, prepreg, circuit board and build-up film
Inventors:
KIMURA SHUNJI (JP)
TANAKA TSUYOSHI (JP)
Application Number:
PCT/JP2022/013123
Publication Date:
September 29, 2022
Filing Date:
March 22, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08G59/40; C08K3/013; C08K3/24; C08L63/00; C08L101/00; H01P3/16; H01Q13/08
Foreign References:
JP2005038821A2005-02-10
JPH07241853A1995-09-19
US20150183987A12015-07-02
CN103351578A2013-10-16
JP6870778B12021-05-12
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ELECTRIC COMPRESSOR

Next Patent: HYDROPHILIC COPOLYMER AND MEDICAL INSTRUMENT