Title:
THERMOSETTING RESIN COMPOSITION, ELECTRONIC COMPONENT, COIL FOR ELECTRICAL APPLIANCE, ELECTRICAL APPLIANCE, AND CABLE
Document Type and Number:
WIPO Patent Application WO/2016/120950
Kind Code:
A1
Abstract:
Provided is a thermosetting resin composition which can bring about stress relaxation due to a transesterification reaction and which includes such structures and can be used for a long period.
The thermosetting resin composition according to the present invention has ester bonds and functional groups each protected by a protective group, the functional groups being deprotected by an external stimulus, and the functional groups being capable of undergoing a transesterification reaction with the ester bonds.
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Inventors:
TADA YASUHIKO (JP)
MURAKI TAKAHITO (JP)
KAJIHARA YURI (JP)
MURAKI TAKAHITO (JP)
KAJIHARA YURI (JP)
Application Number:
PCT/JP2015/051954
Publication Date:
August 04, 2016
Filing Date:
January 26, 2015
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
C08G59/00; C08L63/00
Foreign References:
| JPH08193121A | 1996-07-30 | |||
| JP2014153463A | 2014-08-25 | |||
| JP2006323039A | 2006-11-30 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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