Title:
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2021/132495
Kind Code:
A1
Abstract:
The present invention provides: a thermosetting resin composition; a prepreg, a laminate and a printed wiring board, each of which uses this thermosetting resin composition; and a semiconductor package. This thermosetting resin composition specifically contains (a) a maleimide compound that has at least one N-substituted maleimide group and (b) an inorganic filler, while having a content of the inorganic filler (b) of from 53% by volume to 65% by volume relative to the total amount of the thermosetting resin composition; and this thermosetting resin composition additionally contains (c) a compound that has at least two unsaturated aliphatic hydrocarbon groups.
Inventors:
KATO TETSUYA (JP)
TAKAYAMA TOMOKI (JP)
FUJITA HIROAKI (JP)
SAKAMOTO NORIHIKO (JP)
OTSUKA KOHEI (JP)
SUGENO YU (JP)
TAKAYAMA TOMOKI (JP)
FUJITA HIROAKI (JP)
SAKAMOTO NORIHIKO (JP)
OTSUKA KOHEI (JP)
SUGENO YU (JP)
Application Number:
PCT/JP2020/048522
Publication Date:
July 01, 2021
Filing Date:
December 24, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B32B27/00; B32B15/08; C08J5/24; C08K3/013; C08L79/08
Domestic Patent References:
| WO2018016534A1 | 2018-01-25 | |||
| WO2019181139A1 | 2019-09-26 |
Foreign References:
| JPH06122765A | 1994-05-06 | |||
| JP2016132738A | 2016-07-25 | |||
| JP2017145345A | 2017-08-24 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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