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Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/145474
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a thermosetting resin composition which has a low refractive index after curing and is capable of forming a thick film. The present invention relates to a thermosetting resin composition which contains (A) a polysiloxane that is a hydrolysis-condensation product of methyltrialkoxysilane and tetraethoxysilane and has a weight average molecular weight of 10,000 to 100,000 in an amount of 1 to 35% by weight of the solid content, and (B) beaded silica in an amount of 65 to 99% by weight of the solid content.

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Inventors:
KANAYA SHINGO (JP)
ORIGUCHI KAZUKI (JP)
Application Number:
PCT/JP2023/000651
Publication Date:
August 03, 2023
Filing Date:
January 12, 2023
Export Citation:
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Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
C08L83/04; B32B27/00; C08K3/36
Domestic Patent References:
WO2012124693A12012-09-20
Foreign References:
JP2016135838A2016-07-28
JP2015194740A2015-11-05
JP2019139208A2019-08-22
JP2014201598A2014-10-27
JP2007182491A2007-07-19
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
Download PDF:
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