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Title:
RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAMINATED BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/145473
Kind Code:
A1
Abstract:
A resin composition according to the present invention contains: a core-shell rubber (A) having a core that contains a silicone polymer and/or an acrylic polymer and a shell that contains a poly(methyl methacrylate), said rubber having a harness of 40 or less; a curable resin (B) that includes a maleimide compound (B1) and a benzoxazine compound (B2) having an allyl group; and an inorganic filler (C).

Inventors:
ISHIKAWA YUICHI
HONMA MASAFUMI
WASHIO TEPPEI
ONUMA NORIKO
MIDORIKAWA HIROFUMI
Application Number:
PCT/JP2023/000643
Publication Date:
August 03, 2023
Filing Date:
January 12, 2023
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08F2/44; B32B5/28; B32B15/04; C08J5/24; C08K3/013; C08L9/00; C08L25/04; C08L33/04; C08L51/06; C08L79/00; C08L83/10; H01B5/14; H05K1/03
Domestic Patent References:
WO2020173216A12020-09-03
Foreign References:
US20210253855A12021-08-19
US20190071548A12019-03-07
JP2016196635A2016-11-24
JP2012528237A2012-11-12
JP2020158705A2020-10-01
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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