Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THICK FILM RESISTANCE SLURRY
Document Type and Number:
WIPO Patent Application WO/2021/244060
Kind Code:
A1
Abstract:
Disclosed is a thick film resistance slurry, which comprises at least two among Ag powder, Pt powder, and Ag-Pt alloy powder; the Pt powder or the Ag-Pt alloy powder is at least one among honeycomb-shaped, flocculent, spherical, and spheroid-shaped; and the ratio of the lengths of the long axis and short axis of at least 90wt% Pt powder or Ag-Pt alloy powder within the Pt powder or the Ag-Pt alloy powder is: long axis:short axis = 1-3. Conductive phase components in the thick film resistance slurry of the present invention use Pt to replace Pd. Once Pt powder replaces Pd powder, the TCR of resistors below 100Ω/□ is lowered, and the objectives of reducing costs and improving the TCR performance can be achieved; and once Pt replaces the Pd powder, the short-term overload performance of the thick film resistance is ensured to be kept the same or made better.

Inventors:
QIU JIHUA (CN)
Application Number:
PCT/CN2021/075363
Publication Date:
December 09, 2021
Filing Date:
February 05, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
CHAOZHOU THREE CIRCLE GROUP CO (CN)
International Classes:
H01B1/22; H01C7/00
Foreign References:
CN111739675A2020-10-02
JPH06223615A1994-08-12
JPH0228913A1990-01-31
CN110931145A2020-03-27
CN107871542A2018-04-03
CN101341557A2009-01-07
CN108053960A2018-05-18
US3634334A1972-01-11
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
Download PDF: