Title:
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT MODULE HAVING SAME
Document Type and Number:
WIPO Patent Application WO/2021/193512
Kind Code:
A1
Abstract:
[Problem] To provide a thin film capacitor that can obtain a low impedance in a wide frequency range. [Solution] This thin film capacitor comprises: a capacitor layer 4 having a structure in which internal electrode layers 11-18 and dielectric layers 21-27 are alternately laminated; a re-wiring layer 40 laminated on the capacitor layer 4; and external terminals 51, 52. The re-wiring layer 40 includes: a wiring pattern 41 for connecting the external terminal 51 and the internal electrode layers 11, 13, 15, 17; and a wiring pattern 42 for connecting the external terminal 52 and the internal electrode layers 12, 14, 16, 18. The distance W1 between via conductors 31, 32 is shorter than the distance W3 between via conductors 32, 33 and shorter than the distance W4 between via conductors 31, 34.
Inventors:
ISHII DAIKI (JP)
WAKATA EIKO (JP)
WAKATA EIKO (JP)
Application Number:
PCT/JP2021/011668
Publication Date:
September 30, 2021
Filing Date:
March 22, 2021
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/33; H01G4/38
Domestic Patent References:
| WO2009078225A1 | 2009-06-25 |
Foreign References:
| JP2009224565A | 2009-10-01 | |||
| JP2018074132A | 2018-05-10 | |||
| JP2000514243A | 2000-10-24 | |||
| JP2018063980A | 2018-04-19 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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