Title:
THIN-FILM CAPACITOR AND ELECTRONIC CIRCUIT PROVIDED WITH THIN-FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2024/004395
Kind Code:
A1
Abstract:
[Problem] To provide a thin-film capacitor having excellent heat radiation characteristics. [Solution] A thin-film capacitor 10 comprises: a lower electrode layer 11 made of a metal foil; an upper electrode layer 13 that covers one surface 11A of the lower electrode layer 11 with a dielectric layer 12 therebetween; a passivation layer 14 that covers the one surface 11A of the lower electrode layer 11 so as to have the dielectric layer 12 and the upper electrode layer 13 embedded therein; terminal electrodes 21, 22 provided on the passivation layer 14; a via conductor 31 that is provided so as to penetrate the passivation layer 14 and that connects the terminal electrode 21 and the lower electrode layer 11; and a via conductor 32 that is provided so as to penetrate the passivation layer 14 and that connects the terminal electrode 22 and the upper electrode layer 13. The terminal electrode 21 has a larger plane size than the terminal electrode 22, and the via conductor 31 has a larger cross-sectional area than the via conductor 32.
Inventors:
HIRAOKA MASAHIRO (JP)
SAITA HITOSHI (JP)
SAITA HITOSHI (JP)
Application Number:
PCT/JP2023/017716
Publication Date:
January 04, 2024
Filing Date:
May 11, 2023
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/33; H01G4/30; H01L21/822; H01L27/04
Domestic Patent References:
| WO2020235175A1 | 2020-11-26 |
Foreign References:
| US20180040422A1 | 2018-02-08 | |||
| JP2007234843A | 2007-09-13 | |||
| JP2021129002A | 2021-09-02 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
Download PDF: