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Title:
THIN FILM ENCAPSULATING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/261900
Kind Code:
A1
Abstract:
The present invention relates to a solvent-free thin film encapsulating composition comprising a ladder-type polysilsesquioxane in which a photocurable functional group is grafted to a siloxane backbone, and a thin film encapsulating layer manufactured using same.

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Inventors:
GOTO KOHEI (KR)
LEE JUN HYUP (KR)
Application Number:
PCT/KR2021/007856
Publication Date:
December 30, 2021
Filing Date:
June 23, 2021
Export Citation:
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Assignee:
NCK CO LTD (KR)
FOUNDATION SOONGSIL UNIV INDUSTRY COOPERATION (KR)
International Classes:
C08L83/04; C08F2/48; C08F220/00; C08F230/08; C08F283/12; C08G77/18; C08G77/20; H01L51/52
Foreign References:
KR20130016069A2013-02-14
KR101768309B12017-08-16
KR102054979B12019-12-10
KR101412945B12014-06-26
KR20160035373A2016-03-31
Attorney, Agent or Firm:
KOREANA PATENT FIRM (KR)
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