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Title:
THIN FILM SPECIMEN FOR TENSILE TEST AND PHYSICAL PROPERTY EVALUATION METHOD FOR THIN FILM SPECIMEN
Document Type and Number:
WIPO Patent Application WO/2021/177569
Kind Code:
A1
Abstract:
The present invention relates to a physical property evaluation method for a thin film specimen and a thin film specimen for a tensile test. In the present invention, a digital image correlation analysis method is used to analyze a deformation ratio of a speckle pattern formed on a thin film specimen in a tension test for the thin film specimen. Therefore, the present invention can enhance the reliability of a measured physical property and prevent abnormal breaking of a metal thin film specimen.

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Inventors:
LEE HAN SOL (KR)
CHOI JEE SOON (KR)
CHOI YONG SEOK (KR)
Application Number:
PCT/KR2020/019049
Publication Date:
September 10, 2021
Filing Date:
December 24, 2020
Export Citation:
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Assignee:
LG ENERGY SOLUTION LTD (KR)
International Classes:
G01N3/08; G01B11/16; G01N3/06; G01N15/02
Foreign References:
US20120287248A12012-11-15
KR20160077704A2016-07-04
JPS603537A1985-01-09
JPH09101249A1997-04-15
KR100742546B12007-07-25
KR20200027190A2020-03-12
JP4560079B22010-10-13
Attorney, Agent or Firm:
KIM, Hong Gyun (KR)
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