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Title:
THIN INTEGRATED STRUCTURE VAPOR CHAMBER
Document Type and Number:
WIPO Patent Application WO/2021/073159
Kind Code:
A1
Abstract:
The present invention provides a thin integrated structure vapor chamber. A vapor chamber body and a plastic component are integrated into an integral component so that the vapor chamber is high in precision and good in strength, additional locking and fixing bonding parts and labor costs are not needed, a central heat dissipation area of the vapor chamber fills in a whole electronic mobile terminal, and heat conduction and heat dissipation effects are improved. The vapor chamber comprises the vapor chamber body and a plastic portion. The vapor chamber body comprises a middle heat dissipation portion and a peripheral connection portion. The plastic portion comprises a middle heat dissipation portion placement area and a pre-embedded frame. The central area of the pre-embedded frame is the middle heat dissipation portion placement area. The peripheral connection portion is embedded in a thickness direction area of the pre-embedded frame, the corresponding pre-embedded frame covers the upper surface and the lower surface of the peripheral connection portion, the middle heat dissipation portion is located in the middle heat dissipation portion placement area, and the upper surface and the lower surface of the middle heat dissipation portion are exposed.

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Inventors:
CAI WENLONG (CN)
HONG GUANG (CN)
YAN XIAOFENG (CN)
ZHANG YUGUANG (CN)
Application Number:
PCT/CN2020/099394
Publication Date:
April 22, 2021
Filing Date:
June 30, 2020
Export Citation:
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Assignee:
KUNSHAN LEMTECH ELECTRONICS TECH CO LTD (CN)
International Classes:
H05K7/20; F28D15/04
Foreign References:
CN110678046A2020-01-10
CN210900132U2020-06-30
CN110567301A2019-12-13
US20160128233A12016-05-05
US20160128233A12016-05-05
CN101008403A2007-08-01
US20160037681A12016-02-04
US20190116698A12019-04-18
Attorney, Agent or Firm:
SUZHOU GUOCHENG PATENT AGENCY CO., LTD (CN)
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