Title:
THROUGH ELECTRODE SUBSTRATE, METHOD FOR PRODUCING SAME AND MOUNTING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/209296
Kind Code:
A1
Abstract:
This method for producing a through electrode substrate comprises: a step for preparing a substrate which comprises a first surface and a second surface that is positioned on the reverse side of the first surface, and which is provided with a through hole; a step for arranging a sealing layer on the first surface of the substrate, said sealing layer closing the through hole; an electrode formation step for forming a through electrode within the through hole, said through electrode having a first portion that extends along the lateral wall of the through hole and a second portion that is connected to the first portion and spreads along the sealing layer; and a step for removing the sealing layer.
Inventors:
KUDO HIROSHI (JP)
TAKANO TAKAMASA (JP)
TAKANO TAKAMASA (JP)
Application Number:
PCT/JP2017/020702
Publication Date:
December 07, 2017
Filing Date:
June 02, 2017
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H01L23/32; H01L23/15; H05K1/11; H05K3/40
Domestic Patent References:
| WO2016075863A1 | 2016-05-19 |
Foreign References:
| JPH0964231A | 1997-03-07 | |||
| JP2009059822A | 2009-03-19 | |||
| JP2010199530A | 2010-09-09 | |||
| JP2013524534A | 2013-06-17 | |||
| JP2008251721A | 2008-10-16 |
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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