TOUCH SENSOR MODULE AND PRODUCTION METHOD THEREFOR

Title:

TOUCH SENSOR MODULE AND PRODUCTION METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2016/099044

Kind Code:

A1

Abstract:

The present invention relates to a touch sensor module and a method for producing the touch sensor module and, more specifically, to a touch sensor module comprising: a separation layer for carrier substrate adhesion; a first protection layer disposed on the separation layer for carrier substrate adhesion; a touch sensor layer disposed on the first protection layer; a second protection layer disposed on the touch sensor layer; and a film adhesion layer disposed on the second protection layer, wherein the film adhesion layer has greater adhesiveness than the separation layer for carrier substrate adhesion and has an elastic modulus of 1×107 Pa to 9×109 Pa and has excellent resistance against an external impact and can thereby minimize the occurrence of cracks.

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Inventors:

CHOI BONG JIN (KR)
AN MYUNG YOUNG (KR)

Application Number:

PCT/KR2015/012672

Publication Date:

June 23, 2016

Filing Date:

November 24, 2015

Export Citation:

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Assignee:

DONGWOO FINE CHEM CO LTD (KR)

International Classes:

G06F3/041

Domestic Patent References:

WO2012138030A1

2012-10-11

Foreign References:

KR20140114257A	2014-09-26
US20140065416A1	2014-03-06
KR20140023624A	2014-02-27
KR20130010868A	2013-01-29

Attorney, Agent or Firm:

DOOHO IP LAW FIRM (KR)
두호특허법인 (KR)

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