Title:
TRANSFER FILM, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING CIRCUIT WIRING SUBSTRATE, CIRCUIT WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/210777
Kind Code:
A1
Abstract:
An embodiment of the present invention is: a transfer film having a temporary support, a surfactant-containing middle layer, and a photosensitive layer and having a surface free energy, for the surface on the side not containing the temporary support and exposed by detaching the temporary support, of not more than 66.0 mJ/m2; a method for producing a laminate; a method for producing a circuit wiring substrate; a circuit wiring substrate; and a semiconductor package.
Inventors:
ONITSUKA HISASHI (JP)
MOROZUMI KAZUMASA (JP)
MOROZUMI KAZUMASA (JP)
Application Number:
PCT/JP2023/016746
Publication Date:
November 02, 2023
Filing Date:
April 27, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/11; B32B7/06; B32B27/00; G03F7/004; G03F7/033; H05K3/00; H05K3/18
Domestic Patent References:
| WO2017007001A1 | 2017-01-12 | |||
| WO2019146380A1 | 2019-08-01 | |||
| WO2021033451A1 | 2021-02-25 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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