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Title:
TRANSFER FILM, PATTERN FORMING METHOD, AND CIRCUIT WIRING MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/004430
Kind Code:
A1
Abstract:
Provided are: a transfer film including a temporary support and a transfer layer disposed on the temporary support, the temporary support having a thermal deformation rate of 1.0% or less; and a use for said transfer film.

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Inventors:
ISHIZAKA SOJI (JP)
MOROZUMI KAZUMASA (JP)
Application Number:
PCT/JP2023/018834
Publication Date:
January 04, 2024
Filing Date:
May 19, 2023
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B7/027; G03F7/004; G03F7/027; G03F7/038; G03F7/09; G03F7/11; G03F7/20; G03F7/40; H05K3/18
Domestic Patent References:
WO2019074112A12019-04-18
WO2022092160A12022-05-05
WO2021065317A12021-04-08
WO2020194948A12020-10-01
Foreign References:
JP2004207425A2004-07-22
KR102127757B12020-06-29
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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