Title:
TRANSFER METHOD AND MANUFACTURING METHOD AND DEVICE OF MICRO LIGHT EMITTING DIODE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/109390
Kind Code:
A1
Abstract:
A transfer method and a manufacturing method and device of a micro light emitting diode and an electronic device. The transfer method comprises: epitaxially growing, sequentially in the order of a blue micro light emitting diode (203), a green micro light emitting diode (204), and a red micro light emitting diode (205), micro light emitting diodes of two or three colors of said colors on the same GaAs original substrate; growing bump electrodes (208) corresponding to the micro light emitting diodes on a receiving substrate (207); bonding the micro light emitting diodes of the two or three colors to the bump electrodes (208) on the receiving substrate (207); and removing the GaAs original substrate (201). The method can realize one-time transfer of micro light emitting diodes of multiple colors, thereby improving production efficiency.
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Inventors:
FENG XIANGXU (CN)
CHEN PEIXUAN (CN)
ZOU QUANBO (CN)
CHEN PEIXUAN (CN)
ZOU QUANBO (CN)
Application Number:
PCT/CN2017/117237
Publication Date:
June 13, 2019
Filing Date:
December 19, 2017
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
H01L33/00; H01L27/15
Foreign References:
| CN104584110A | 2015-04-29 | |||
| CN106653962A | 2017-05-10 | |||
| CN107017319A | 2017-08-04 | |||
| US20140225136A1 | 2014-08-14 |
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
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